发明授权
- 专利标题： Optically-masked microelectronic packages and methods for the fabrication thereof
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申请号： US14086745申请日： 2013-11-21
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公开(公告)号： US09997492B2公开(公告)日： 2018-06-12
- 发明人: Weng F. Yap , Scott M. Hayes , Alan J. Magnus
- 申请人： Weng F. Yap , Scott M. Hayes , Alan J. Magnus
- 申请人地址： US TX Austin
- 专利权人： NXP USA, INC.
- 当前专利权人： NXP USA, INC.
- 当前专利权人地址： US TX Austin
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L23/31 ; H01L21/56
摘要：
Microelectronic packages and methods for fabricating microelectronic packages having optical mask layers are provided. In one embodiment, the method includes building redistribution layers over the frontside of a semiconductor die. The redistribution layers includes a body of dielectric material in which a plurality of interconnect lines are formed. An optical mask layer is formed over the frontside of the semiconductor die and at least a portion of the redistribution layers. The optical mask layer has an opacity greater than the opacity of the body of dielectric material and blocks or obscures visual observation of an interior portion of the microelectronic package through the redistribution layers.
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