Invention Grant
- Patent Title: Composite substrate, semiconductor chip having a composite substrate and method for producing composite substrates and semiconductor chips
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Application No.: US14739684Application Date: 2015-06-15
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Publication No.: US09997671B2Publication Date: 2018-06-12
- Inventor: Johannes Baur , Berthold Hahn , Volker Haerle , Karl Engl , Joachim Hertkorn , Tetsuya Taki
- Applicant: OSRAM Opto Semiconductors GmbH
- Applicant Address: DE Regensburg
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE Regensburg
- Agency: Slater Matsil, LLP
- Priority: DE102010056447 20101228; DE102011012298 20110224
- Main IPC: H01L33/32
- IPC: H01L33/32 ; H01L33/50 ; H01L33/00 ; H01L33/08 ; H01L21/02 ; H01L21/78 ; H01L29/02 ; H01L33/46 ; H01L23/00
Abstract:
A composite substrate has a carrier and a utility layer. The utility layer is attached to the carrier by means of a dielectric bonding layer and the carrier contains a radiation conversion material. Other embodiments relate to a semiconductor chip having such a composite substrate, a method for producing a composite substrate and a method for producing a semiconductor chip with a composite substrate.
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