Invention Grant
- Patent Title: Resistive memory device having field enhanced features
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Application No.: US14898380Application Date: 2013-07-25
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Publication No.: US09997703B2Publication Date: 2018-06-12
- Inventor: Si-Ty Lam , Xia Sheng , Richard H. Henze , Zhang-Lin Zhou
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee Address: US TX Houston
- Agency: Hewlett Packard Enterprise Patent Department
- International Application: PCT/US2013/052050 WO 20130725
- International Announcement: WO2015/012839 WO 20150129
- Main IPC: H01L29/04
- IPC: H01L29/04 ; H01L45/00 ; H01L27/24

Abstract:
A resistive memory device includes a bottom electrode and a top electrode sandwiching a switching layer. The device also includes a field enhancement (FE) feature that extends from the bottom electrode either into the switching layer or is covered by switching layer and that is to enhance an electric field generated by the two electrodes to thereby confine a switching area of the device at the FE feature. The device further includes a planar interlayer dielectric surrounding the device, for supporting the top electrode. A method of making a resistive memory device, employing in-situ vacuum deposition of all layers, is also provided.
Public/Granted literature
- US20160141494A1 RESISTIVE MEMORY DEVICE HAVING FIELD ENHANCED FEATURES Public/Granted day:2016-05-19
Information query
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