Invention Grant
- Patent Title: Support structure for power electronics
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Application No.: US15088807Application Date: 2016-04-01
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Publication No.: US09999151B2Publication Date: 2018-06-12
- Inventor: Marcus Lindblom , Michael Weiss
- Applicant: ABB Technology AG
- Applicant Address: CH Baden
- Assignee: ABB Schweiz AG
- Current Assignee: ABB Schweiz AG
- Current Assignee Address: CH Baden
- Agency: Taft Stettinius & Hollister LLP
- Agent J. Bruce Schelkopf
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K7/14 ; H05K9/00

Abstract:
The application concerns a support structure for power electronics, comprising a holder for the insertion of at least one power electronics module and an electrically conductive external geometry which surrounds the holder and has rounded corners and edges with a radius of curvature which is greater than a predetermined minimum radius.
Public/Granted literature
- US20160219743A1 SUPPORT STRUCTURE FOR POWER ELECTRONICS Public/Granted day:2016-07-28
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