- 专利标题： Bond pattern for substrate
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申请号： US29859142申请日： 2022-11-08
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公开(公告)号： USD1031026S1公开(公告)日： 2024-06-11
- 设计人: Ray Dennis Dria , Michael Joseph Page , Joseph Leslie Grolmes , Scott Alan King , Matthew Steven Ritter , Christopher Colin Arp
- 申请人： The Procter & Gamble Company
- 申请人地址： US OH Cincinnati
- 专利权人： The Procter & Gamble Company
- 当前专利权人： The Procter & Gamble Company
- 当前专利权人地址： US OH Cincinnati
- 代理商 Daniel S. Albrecht; Sarah M. DeCristofaro
- 分案原申请号： US29807499 2021.09.13
- LOC分类号： 02-01
摘要：
FIG. 1 is a perspective view of a bond pattern for a substrate;
FIG. 2 is a view of the front side of the bond pattern for a substrate of FIG. 1;
FIG. 3 is a view of the right side of the bond pattern for a substrate of FIG. 1;
FIG. 4 is a view of the back side of the bond pattern for a substrate of FIG. 1;
FIG. 5 is a view of the left side of the bond pattern for a substrate of FIG. 1;
FIG. 6 is a view of the top side of the bond pattern for a substrate of FIG. 1; and,
FIG. 7 is a view of the bottom side of the bond pattern for a substrate of FIG. 1.
The broken lines are included for the purpose of illustrating environment and form no part of the claimed design.
FIG. 2 is a view of the front side of the bond pattern for a substrate of FIG. 1;
FIG. 3 is a view of the right side of the bond pattern for a substrate of FIG. 1;
FIG. 4 is a view of the back side of the bond pattern for a substrate of FIG. 1;
FIG. 5 is a view of the left side of the bond pattern for a substrate of FIG. 1;
FIG. 6 is a view of the top side of the bond pattern for a substrate of FIG. 1; and,
FIG. 7 is a view of the bottom side of the bond pattern for a substrate of FIG. 1.
The broken lines are included for the purpose of illustrating environment and form no part of the claimed design.
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