再颁专利
- 专利标题： Wafer treating method for making adhesive dies
- 专利标题（中）： 用于制造粘合剂模具的晶片处理方法
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申请号： US11371307申请日： 2006-03-07
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公开(公告)号： USRE42349E1公开(公告)日： 2011-05-10
- 发明人: Chun-Hung Lin , Jesse Huang , Kuang-Hui Chen , Shih-Wen Chou
- 申请人： Chun-Hung Lin , Jesse Huang , Kuang-Hui Chen , Shih-Wen Chou
- 申请人地址： BM Hamilton TW Hsinchu
- 专利权人： ChipMOS Technologies (Bermuda),ChipMOS Technologies Inc.
- 当前专利权人： ChipMOS Technologies (Bermuda),ChipMOS Technologies Inc.
- 当前专利权人地址： BM Hamilton TW Hsinchu
- 代理机构： J.C. Patents
- 主分类号： B05D5/10
- IPC分类号： B05D5/10 ; B05D3/12 ; H01L21/00
摘要：
A wafer treating method for making adhesive dies is provided. A liquid adhesive with two-stage property is coated on a surface of a wafer. Then, the wafer is pre-cured to make the liquid adhesive transform a thermo-bonding adhesive film having B-stage property which has a glass transition temperature not less than 40° C. for handling without adhesive under room temperature. After positioning the wafer, the wafer is singulated to form a plurality of dies with adhesive for die-to-die stacking, die-to-substrate or die-to-leadframe attaching.
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