发明申请
- 专利标题： APPARATUS AND METHOD FOR ALIGNING SURFACE MOUNTABLE ELECTRONIC COMPONENTS ON PRINTED CIRCUIT BOARD PADS
- 专利标题（中）： 印刷电路板贴面上表面安装电子元件的装置和方法
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申请号： PCT/US1988002234申请日： 1988-06-30
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公开(公告)号： WO1989001283A1公开(公告)日： 1989-02-09
- 发明人: WESTERN DIGITAL CORPORATION , ELLIOTT, James, N.
- 申请人： WESTERN DIGITAL CORPORATION
- 专利权人： WESTERN DIGITAL CORPORATION
- 当前专利权人： WESTERN DIGITAL CORPORATION
- 优先权： US81,343 19870804
- 主分类号： H05K13/04
- IPC分类号： H05K13/04
摘要：
A method and apparatus are described for precisely centering the leads of surface mountable electronic components on the pads of a printed circuit board. The method includes coating the pads with solder, placing the leads of the components on the solder coated pads, melting the solder and vibrating the leads relative to the pads while the solder is molten, so that the surface tension of the molten solder centers the leads on the pads. The molten solder is then cooled until it resolidifies.
