A process for bonding a superconductor by mechanical deposition of a metal on the surface of the superconductor is disclosed. To ensure rapid, simple, defect-free bonding even under normal atmospheric conditions, particles are removed from the surface of the superconductor and immediately metal particles of a good conductor of electricity such as silver, gold or copper are coated or deposited on the surface of the superconductor. The metal particles are deposited onto the surface of the superconductor (3) by a rotating steel brush (10) which rubs against a metal block made of a good conductor of electricity. The surface is first thoroughly cleaned mechanically. The metal particles are then transferred from the metal block (12) to the surface of the superconductor (3).