Proposed is a silicon chip for use in a force-detection sensor. The chip has circuits (22), piezo-resistive elements (21), an intermediate element (36) and a force-application zone (23). The chip (20) is mounted on a support (38). The piezo-resistive elements (21) are disposed in a zone of high mechanical stress and the circuits (22) in a zone of low mechanical stress. The stress distribution within the chip (20) is modified by, for instance, grooves (122) in the chip.