This invention relates to flat cables comprising a plurality of insulated conductors bonded to a metallic substrate. The metallic substrate is provided with a layer of polymeric material capable of bonding to the insulation of the conductors. The layer of polymeric material is bonded to the metallic substrate with a peel strength of at least about 1 pound per linear inch (pli). The insulated conductors are bonded to the layer of polymeric material. The bond strength between the insulated conductors and the layer of polymeric material and the bond strength between the layer of polymeric material and the metallic substrate are such that the individual insulated conductors can be cleanly peeled away from the substrate.