A surface-mountable integrated circuit package having leads arranged in a manner enabling the package to be manufactured with high yield but with reduced pitch between adjacent leads. The circuit package of the invention includes a body (60), and alternating first and second sets (62 and 68) of leads connected along an edge of the body. Each lead (68) in the first set is formed so that its tip extends a first distance from the body. Each lead (66) in the second set is formed so that its tip extends a second distance (substantially different than the first distance) from the body. Even if the leads are mounted with very small pitch, the separation of the tips of adjacent leads will be substantially greater than the pitch. For this reason, the package can be manufactured with high yield and reduced pitch, and shipped with formed leads with only a low risk that the leads will be accidentally bent into electrical contact with each other and without the need to enclose individual packages in individual protective cases for shipment. In a preferred embodiment, the invention includes a first set of leads having a gull-wing configuration alternating with a second set of leads having a J-bend configuration (91). In another preferred embodiment, leads having a gull-wing configuration alternate with leads having an L-bend configuration (101).