A resilient, fixed-spacing, fixed-orientation mounting of a lens (450) with respect to a semiconductor die (430) having an array of photosensitive elements is established by forming ''legs'' on the lens and corresponding ''landing pads'' on the die, and further by providing locating pins (463, 469) passing through a flexible substrate (434) mounting the die and into a PCB (480) supporting the substrate-mounted die. In one embodiment, the locating pins are discrete elements. In another embodiment, the pins are formed integrally with the legs of the lens. In either case, the landing pads are preferably formed on the die as ''bumps'' formed in a tape-automated bonding (TAB) process.