Invention Application
WO1995010866A1 PROCESS AND DEVICE FOR COMPACTING AND SUBSEQUENTLY WELDING ELECTRIC CONDUCTORS
审中-公开
方法和设备压制成型和电导体中的后续焊接
- Patent Title: PROCESS AND DEVICE FOR COMPACTING AND SUBSEQUENTLY WELDING ELECTRIC CONDUCTORS
- Patent Title (中): 方法和设备压制成型和电导体中的后续焊接
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Application No.: PCT/EP1994003343Application Date: 1994-10-11
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Publication No.: WO1995010866A1Publication Date: 1995-04-20
- Inventor: SCHUNK ULTRASCHALLTECHNIK GMBH
- Applicant: SCHUNK ULTRASCHALLTECHNIK GMBH , STEINER, Ernst , STROH, Dieter , GÖTZ, Heinz
- Assignee: SCHUNK ULTRASCHALLTECHNIK GMBH,STEINER, Ernst,STROH, Dieter,GÖTZ, Heinz
- Current Assignee: SCHUNK ULTRASCHALLTECHNIK GMBH,STEINER, Ernst,STROH, Dieter,GÖTZ, Heinz
- Priority: DEP 19931014
- Main IPC: H01R43/02
- IPC: H01R43/02
Abstract:
The invention relates to a process and a device for compacting and then welding electric conductors, especially for making through or terminal connections of flexes by means of ultrasound in a compression chamber (10) adapted to the conductor and adjustable for height (h) and width (b), in which the conductors to be welded are first compacted and then welded. The compression chamber is adjustable to a predetermined height-width ratio regardless of the cross section of the conductors to be welded.
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