A substrate mating assembly has a first substrate (10) with at least one socket (14) mounted thereon. The at least one socket has contact retention points (30) provided thereon which extend into a contact receiving opening (24) thereof. A second substrate (2) is provided with at least one mating contact (6) mounted thereon. The at least one mating contact (6) has an arcuate surface and is dimensioned to be received in the contact receiving opening (24) of the at least one socket (14). As the first substrate and the second substrate are electrically mated together, the at least one mating contact (6) is received in the contact receiving opening (24) and maintained in position therein by the cooperation of the contact retention points (30) with the arcuate surface of the at least one mating contact. The contact retention points are provided on resilient arms (26) which are configured to allow for the elastic distorsion thereof as the at least one mating contact (6) is brought into engagement with the at least one socket (14), such that when the at least one mating contact is fully inserted, the resilient arms (26) will return toward an unstressed position to cooperate with the arcuate surface of the at least one mating contact to maintain the at least one mating contact in position.