A current supply module is disclosed for mounting on a component-carrying printed circuit board in which individual elements are arranged on a modular printed circuit board. In order to economically produce such a current supply module and to solve in a reliable manner heat dissipation problems, the active components of the module are mounted in an open configuration on a ceramic plate produced by thick film technology. The module is mounted with its component face facing the component-carrying printed circuit board or is mounted within an opening in the printed circuit board, thus achieving reliable heat dissipation with low overall height.