The invention relates to a process for soldering additional electronic components (12) to a printed circuit board (10), which has pre-assembled and pre-soldered components (13), the additional components (12) being inserted into the printed circuit board (10) and soldered therein. To solder the components (12) subsequently in a simple and reliable manner, a template (8) having a pattern of openings corresponding to the solder points or areas to be subsequently formed on the printed circuit board is lowered and pressed on the surface of a solder bath (7) in such a manner that the solder flows into the holes and rises therein. The printed circuit board (10) with the additional pre-assembled components is mounted on the template (8) in such a manner that the areas to be soldered are arranged inside the openings of the template and dip into the available solder. After the actual soldering process, the printed circuit board (10) and the template (8) are lifted from the surface of the solder bath (7), and said bath can subsequently be cleaned.