Invention Application
- Patent Title: GROUND PLATE AND HIGH-FREQUENCY GROUNDING SYSTEM
- Patent Title (中): 接地板和高频接地系统
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Application No.: PCT/JP1997003189Application Date: 1997-09-10
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Publication No.: WO1998011628A1Publication Date: 1998-03-19
- Inventor: HITACHI ELECTRONICS SERVICES CO., LTD.
- Applicant: HITACHI ELECTRONICS SERVICES CO., LTD. , KANEKO, Minoru , SATO, Tsutomu , JITSUHARA, Kokichi , NANMO, Koji
- Assignee: HITACHI ELECTRONICS SERVICES CO., LTD.,KANEKO, Minoru,SATO, Tsutomu,JITSUHARA, Kokichi,NANMO, Koji
- Current Assignee: HITACHI ELECTRONICS SERVICES CO., LTD.,KANEKO, Minoru,SATO, Tsutomu,JITSUHARA, Kokichi,NANMO, Koji
- Priority: JPPCT/JP96/02571 19960910
- Main IPC: H01R04/66
- IPC: H01R04/66
Abstract:
In a ground plate (110), the back of a conductive plate and the peripheral end portions of the surface are insulated (120) in advance. A plurality of L- or T-shaped tab terminals (100) are soldered to the ground plate (110). A connection terminal (140) to be connected with an electronic device is connected to one end portion of a wiring line (130), and a plug-in type connection terminal (150) to be connected with each of a plurality of projection terminal is connected to the other end portion. At the assembly, the tab terminal (100) is fitted in the plug-in type connection terminal (140) of the connection line, and this ground plate (110) is placed on the floor of a building to connect the connection terminal (140) of the connection line with the electronic device. This facilitates the assembly.
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