An apparatus and method for establishing a reliable compressive electrical connection between an electronic package and surface mount pads (6) of the printed circuit board (4) are disclosed. Contact pads (2) are solderable to pads (6) of the printed circuit board (4) and have electrically compatible metallurgy on the contact surface (10). These contact pads (2) are solderable to the pads (6) on their mounting surface (12). The contact pads (2) are assembled to the printed circuit board (4) by first adhesively attaching an array of contact pads to a film (20) and then placing the array over the pads (6) of the printed circuit board (4), and finally reflowing solder (7) which was previously attached to the pads (6) to complete the attachment.