This invention relates to a method and system for producing a secmiconductor package interconnectably mounted on a semiconductor package substrate (14) without substantial package warpage, and to a method for using a stiffener member (20) to reliably overcome such substantial package warpage. The subject method comprises providing a semiconductor package and a semiconductor package substrate having respective first and second major sides. A stiffener member (20) is attached to the semiconductor package substrate to provide the requisite support for the semiconductor package substrate during the assembly process and thereby counteract the sources of the package warpage problem. A protective outer layer can be optionally added to the subject system.