The invention relates to a self-resetting thermal release, comprising a flat thermostatic bimetal snap element (1, 9), said snap element being fixed on the circuit substrate with high-melting solder by at least one soldered junction and being thermally coupled with said circuit substrate. Said soldered junction is configured as a first contact point (5) for connection to a corresponding circuit contact of the circuit substrate (4). The snap element (1, 9) is mechanically pre-cambered into an arch-shape in such a way that when the release is not activated, it is in electroconductive contact with a second contact point (6) of the circuit substrate (4). When the release is triggered, the camber of the arch is reversed, and so the snap element no longer comes into contact with said second contact point (6).