A method and apparatus (110) for the wireless transfer of measurements made during chemical-mechanical planarization of semiconductor wafers with a planarizing machine. The apparatus (110) includes a sensor (190) connected to the semiconductor substrate (112) or a movable portion of the planarizing machine. The apparatus (110) further comprises a display spaced apart from the sensor (190) and a wireless communication link coupled between the sensor (190) and the display (169) to transmit a signal from the sensor (190) to the display (169). The wireless communication link may include an infrared link, a radio link, an acoustic link, or an inductive link. The sensor (190) may measure force, pressure, temperature, pH, electrical resistance or other planarizing parameters. The sensor (190) may also detect light reflected from a reflective surface of a substrate (112) that is used to calibrate the planarizing machine.