The invention relates to a jack assembly including a jack mount with a jack receiving region. A jack is adapted to be slidably mounted in the jack receiving region. The jack includes a jack body formed of a dielectric material and a plurality of electrically conductive tip and ring springs. The jack body defines a plurality of bores sized to receive plugs having tip and ring contacts. The jack assembly further includes a plurality of cross-connect contacts and a rear interface assembly including a dielectric support. A plurality of rear connectors project outward from the dielectric support, and a circuit board is positioned between the jack mount and the dielectric support. The circuit board provides connections between the cross-connect contacts and the normal contacts. An electrical interface between the jack and the circuit board is configured such that when the jack is removed from the jack mount, the jack is automatically disconnected from the circuit board.