An arrangement for making an electric contact to a semiconductor component (1) for enabling establishing of a low resistance current path between two terminals (2) on one side or opposite sides thereof comprises pieces (2, 6) with a high electric conductivity and means adapted to press them towards a surface or opposite surfaces of said component while forming a stack together therewith. At least one thin layer (7) is arranged between two subsequent members of said stack. Said layer is of a material having a low friction coefficient with respect to one of said subsequent members and is allowed to move with respect thereto as a consequence of different coefficients of thermal expansion of said subsequent members upon temperature changes of these members.