Invention Application
- Patent Title: LAMINATE-BASED APPARATUS AND METHOD OF FABRICATION
- Patent Title (中): 基于层压的装置和制造方法
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Application No.: PCT/US0002145Application Date: 2000-01-27
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Publication No.: WO0044020A3Publication Date: 2001-02-01
- Inventor: STEENBERGE ROBERT W
- Applicant: TELEDYNE TECH INC , STEENBERGE ROBERT W
- Assignee: TELEDYNE TECH INC,STEENBERGE ROBERT W
- Current Assignee: TELEDYNE TECH INC,STEENBERGE ROBERT W
- Priority: US23736599 1999-01-26
- Main IPC: H01H1/00
- IPC: H01H1/00 ; H01H49/00 ; H01H50/00 ; B81C3/00
Abstract:
The present invention discloses a laminated-based electromechanical device and a method of fabricating laminate-based electromechanical devices. The device includes two or more layers of laminate bonded together to form a unitary laminate structure. The layers of laminate include a layer of organic dielectric material that may have at least a portion of one layer of electrically conductive material adherent thereto. The layers of organic dielectric material are bonded to form a unitary laminate structure through a process of lamination. The structures that make up the electromechanical device may be formed either before or after bonding. In particular, the various electromechanical structures that make up the electromechanical device are formed from the layers of organic dielectric material and the layers of electrically conductive material adherent thereto using a predetermined sequence of additive and subtractive fabrication techniques.
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