A connector which provides an interconnect between a pin and a flat conductor. The connector employs two bundles fabricated of densely packed gold plated wire for the electrical connection to the devices. The bundles are both housed in a dielectric sleeve structure and are themselves connected by a solid conductor. A portion of one wire bundle protrudes from one end of the sleeve structure to make electrical contact with a flat conductor in a mating assembly. The second wire bundle is recessed within the sleeve structure adjacent a second end of the sleeve structure. The pin is inserted into the second end in an installation, making electrical contact with the second wire bundle. The outside body of the connector is threaded, allowing an operator to twist the connector into the mating assembly, not requiring tight tolerances to ensure proper contact. The connector provides a robust electrical connection, and also provides for misalignment of the flat connector in addition to variations in the exact location of the pin. The length of the pin in the mating part can vary considerably, and the connector device still provides a controlled impedance interconnect over microwave frequencies. The connector can be installed in a larger assembly thus providing a large number of interconnections to be mating simultaneously. This is accomplished by providing clearances and tapers in the mating housing.