Invention Application
WO00070323A1 SAMPLE CUTTING APPARATUS 审中-公开
样品切割装置

  • Patent Title: SAMPLE CUTTING APPARATUS
  • Patent Title (中): 样品切割装置
  • Application No.: PCT/US1999/010668
    Application Date: 1999-05-13
  • Publication No.: WO00070323A1
    Publication Date: 2000-11-23
  • Main IPC: A01B1/24
  • IPC: A01B1/24 A01B79/00 G01N1/08
SAMPLE CUTTING APPARATUS
Abstract:
An apparatus (10) makes easier, simpler and quicker the obtention of a sample of solid materials for physical and/or chemical testing. The apparatus (10) comprises a housing (24) containing a ram (18), the housing (24) having an anvil end (22) and a cutting end (12). In a method of using the apparatus (10), the cutting end (12) is driven into a substrate (14) and a plug (16) of sample material is obtained. Plug (16) is removed from housing (24) by forcing ram (18) in the direction of plug (16).
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