Invention Application
- Patent Title: METHODS FOR JOINING HIGH TEMPERATURE SUPERCONDUCTING COMPONENTS
- Patent Title (中): 高温超导部件接合方法
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Application No.: PCT/US0015381Application Date: 2000-06-02
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Publication No.: WO0074151A3Publication Date: 2001-04-26
- Inventor: BUZCEK DAVID M , SCUDIERE JOHN D , HARNOIS RICHARD E , SPREAFICO SERGIO , GHERARDI LAURA
- Applicant: AMERICAN SUPERCONDUCTOR CORP
- Assignee: AMERICAN SUPERCONDUCTOR CORP
- Current Assignee: AMERICAN SUPERCONDUCTOR CORP
- Priority: US32422999 1999-06-02
- Main IPC: H01B13/00
- IPC: H01B13/00 ; H01L39/02
Abstract:
A method for joining high temperature superconducting components while minimizing critical current degradation is provided. The articles formed have critical currents that are at least 80 % of the critical current of the high temperature superconducting components. Components (12, 14) in the form of wires or tapes are soldered along and are of overlap by using a solder mateial (16) and covered with a protective material (20). The invention further provides splicing geometries that facilitate wrapping joined components around a mandrel, tube or the like with minimal critical current degradation and without kinking or flexion of the joined components.
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