The invention relates to a method of producing microbore holes in a multi-layer substrate (5), especially a printed board substrate which is displaced below a writing optics (4) by means of an XY plate (6), using said optics to generate a spot of a light source (1), especially a laser. The aim of the invention is to reduce the treatment time and preferably to compensate for advantages of the material of the substrate. To this end, the position of the spot within a working field is changed simultaneously with the treatment positions by means of electronically controlled, movable mirrors. The position of the substrate is specifically determined by means of an interferometer (9, 11) and the signals that correspond to the substrate position are processed to an actual position of the table system by means of a suitably equipped processing unit (16). Said processing unit (16) is preferably provided with all bore hole coordinates and additional information such as bore hole diameter, especially in a tabular form.