Invention Application
- Patent Title: CONDUCTIVE ADHESIVE AND BIOMEDICAL ELECTRODE
- Patent Title (中): 导电胶和生物医学电极
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Application No.: PCT/US2000/035063Application Date: 2000-12-21
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Publication No.: WO01048111A1Publication Date: 2001-07-05
- Main IPC: G01N27/30
- IPC: G01N27/30 ; A61B5/0408 ; A61L24/00 ; A61N1/04 ; C09J4/00 ; C09J9/02 ; C09J11/06 ; C09J155/00 ; C09J201/00 ; H01B1/20
Abstract:
The conductive adhesive of the present invention has a multi-layer structure comprising a hydrophobic phase containing an adhesive polymer, and a hydrophilic phase containing an electrolyte. This conductive adhesive is superior in anti-drying effect (moisturizing effect) because a humectant is effectively contained in the hydrophilic phase. The present invention also relates to a biomedical electrode using such a conductive adhesive. In the biomedical electrode according to the present invention, an adhesive layer to be applied to the skin surface of the human body contains the conductive adhesive described above and an electrode terminal connected with the adhesive layer is provided.
Information query