Invention Application
WO0151220A3 METHOD FOR PRODUCING A MICROSTRUCTURED SURFACE RELIEF BY EMBOSSING THIXOTROPIC LAYERS
审中-公开
用于生产微结构化表面浮雕BY COIN触变LAYERS
- Patent Title: METHOD FOR PRODUCING A MICROSTRUCTURED SURFACE RELIEF BY EMBOSSING THIXOTROPIC LAYERS
- Patent Title (中): 用于生产微结构化表面浮雕BY COIN触变LAYERS
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Application No.: PCT/EP0100333Application Date: 2001-01-12
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Publication No.: WO0151220A3Publication Date: 2002-02-21
- Inventor: GIER ANDREAS , KUNZE NORA , MENNIG MARTIN , OLIVEIRA PETER W , SEPEUR STEFAN , SCHAEFER BRUNO , SCHMIDT HELMUT
- Applicant: INST NEUE MAT GEMEIN GMBH , GIER ANDREAS , KUNZE NORA , MENNIG MARTIN , OLIVEIRA PETER W , SEPEUR STEFAN , SCHAEFER BRUNO , SCHMIDT HELMUT
- Assignee: INST NEUE MAT GEMEIN GMBH,GIER ANDREAS,KUNZE NORA,MENNIG MARTIN,OLIVEIRA PETER W,SEPEUR STEFAN,SCHAEFER BRUNO,SCHMIDT HELMUT
- Current Assignee: INST NEUE MAT GEMEIN GMBH,GIER ANDREAS,KUNZE NORA,MENNIG MARTIN,OLIVEIRA PETER W,SEPEUR STEFAN,SCHAEFER BRUNO,SCHMIDT HELMUT
- Priority: DE10001135 2000-01-13
- Main IPC: B05D5/06
- IPC: B05D5/06 ; B05D1/42 ; B05D3/12 ; B05D7/24 ; B05D1/40
Abstract:
The invention relates to a method for producing a microstructured surface relief by applying a coating composition to a substrate. Said coating composition is thixotropic or acquires thixotropic properties on the substrate when pretreated. According to the invention, an embossing device is used to emboss the surface relief into the applied thixotropic coating composition, and the coating composition hardens after removing the embossing device. The substrates which are obtained by using this method and which are provided with a microstructured surface relief are particularly suited for optical, electronic, micromechanical and/or antisoiling applications.
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