Invention Application
- Patent Title: MICROELECTROMECHANICAL MICRO-RELAY WITH LIQUID METAL CONTACTS
- Patent Title (中): 微电子微型继电器与液体金属接触
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Application No.: PCT/US2001/003305Application Date: 2001-02-01
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Publication No.: WO01057900A1Publication Date: 2001-08-09
- Main IPC: B81B3/00
- IPC: B81B3/00 ; H01H1/00 ; H01H1/04 ; H01H1/08 ; H01H1/62 ; H01H50/00 ; H01H59/00
Abstract:
A MEM relay (110') includes an actuator, a shorting bar (52) disposed on the actuator, a contact substrate, and a plurality of liquid metal contacts (126, 128) are disposed on the contact substrate such that the plurality of liquid metal contacts are placed in electrical communication when the MEM relay is in a closed state. Further, the MEM relay includes a heater (129, 129') disposed on said contact substrate wherein said heater is in thermal communication with the plurality of liquid metal contacts. The contact substrate can additionally include a plurality of wettable metal contacts (125, 127) disposed on the contact substrate wherein each of the plurality of wettable metal contacts is proximate to each of the plurality of liquid metal contacts (126, 128) and each of the wettable metal contact is in electrical communication with each of the plurality of liquid metal contacts.
Information query