Invention Application
- Patent Title: INTEGRATED CHEMICAL-MECHANICAL POLISHING
- Patent Title (中): 综合化学机械抛光
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Application No.: PCT/US2001/011026Application Date: 2001-04-05
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Publication No.: WO01076819A1Publication Date: 2001-10-18
- Main IPC: B24B37/04
- IPC: B24B37/04 ; B24B57/02 ; H01L21/304
Abstract:
The present invention provides a method of polishing and/or cleaning a substrate using a multi-component polishing and/or cleaning composition, wherein the components of the polishing and/or cleaning composition are mixed at the point-of-use or immediately before delivery to the point-of-use. The present invention also provides a method of polishing and/or cleaning more than one substrate simultaneously using a single apparatus, wherein a different polishing or cleaning composition is delivered to each substrate.
Information query
