Invention Application
- Patent Title: HOT PLATE UNIT
- Patent Title (English): Hot plate unit
- Patent Title (中): 热板单元
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Application No.: PCT/JP2001/003757Application Date: 2001-05-01
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Publication No.: WO01087018A1Publication Date: 2001-11-15
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/027 ; H05B1/02 ; H05B3/14 ; H05B3/16 ; H05B3/18 ; H05B3/28 ; H05B3/68 ; H05B3/20
Abstract:
A hot plate unit capable of sufficiently increasing a temperature rising and lowering rate even if the diameter of a substrate is increased and reducing a size, characterized in that the substrate having a temperature control means is installed on a supporting container and the thickness of the supporting container is 50 mm or thinner.
Information query
IPC分类:
