Invention Application
- Patent Title: A METHOD OF SOLDERING AND A PREFORM THEREFOR
- Patent Title (中): 一种焊接方法及其优点
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Application No.: PCT/GB2002/000461Application Date: 2002-02-04
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Publication No.: WO2002062520A1Publication Date: 2002-08-15
- Inventor: LODGE, Kevin, Joseph , HUMPSTON, Giles
- Applicant: BOOKHAM TECHNOLOGY PLC , LODGE, Kevin, Joseph , HUMPSTON, Giles
- Applicant Address: 90 Milton Park, Milton, Abingdon, Oxfordshire OX14 4RY GB
- Assignee: BOOKHAM TECHNOLOGY PLC,LODGE, Kevin, Joseph,HUMPSTON, Giles
- Current Assignee: BOOKHAM TECHNOLOGY PLC,LODGE, Kevin, Joseph,HUMPSTON, Giles
- Current Assignee Address: 90 Milton Park, Milton, Abingdon, Oxfordshire OX14 4RY GB
- Agency: HOSTE, Colin, Francis
- Priority: GB0102771.3 20010203
- Main IPC: B23K35/02
- IPC: B23K35/02
Abstract:
A solder preform (20) is placed between two surfaces to be joined together. The preform has at least three solder wire limbs (21) which radiate outwardly from a centre (22). A cruciform shape is particularly advantageous. When the solder is heated, molten solder flows and expels trapped air from between the surfaces, thus reducing the void area in the joint which forms when the solder solidifies. The method and preform are particularly applicable to manufacture of opto-electronic modules.
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