Invention Application
WO2002065517A2 DEPOSITION OVER MIXED SUBSTRATES USING TRISILANE 审中-公开
使用TRISILANE的混合基板上的沉积

  • Patent Title: DEPOSITION OVER MIXED SUBSTRATES USING TRISILANE
  • Patent Title (中): 使用TRISILANE的混合基板上的沉积
  • Application No.: PCT/US2002/004750
    Application Date: 2002-02-12
  • Publication No.: WO2002065517A2
    Publication Date: 2002-08-22
  • Inventor: TODD, Michael, A.
  • Applicant: ASM AMERICA, INC.
  • Applicant Address: 3440 East University Drive, Phoenix, AZ 85034-7200 US
  • Assignee: ASM AMERICA, INC.
  • Current Assignee: ASM AMERICA, INC.
  • Current Assignee Address: 3440 East University Drive, Phoenix, AZ 85034-7200 US
  • Agency: ALTMAN, Daniel, E.
  • Priority: US60/268,337 200102012; US60/279,256 200103027; US60/311,609 20010809; US60/323,649 200109019; US60/332,696 200111013; US60/333,724 200111028; US60/340,454 20011207
  • Main IPC: H01L21/00
  • IPC: H01L21/00
DEPOSITION OVER MIXED SUBSTRATES USING TRISILANE
Abstract:
Trisilane is used in chemical vapor deposition methods to deposit silicon-containing films over mixed substrates. Such methods are useful in semiconductor manufacturing to provide a variety of advantages, including uniform deposition over heterogeneous surfaces, high deposition rates, and higher manufacturing productivity. An example is in forming the base region of a heterojunction bipolar transistor, including simultaneous deposition over both single crystal semiconductor surfaces and amorphous insulating regions.
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