Invention Application
- Patent Title: DEPOSITION OVER MIXED SUBSTRATES USING TRISILANE
- Patent Title (中): 使用TRISILANE的混合基板上的沉积
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Application No.: PCT/US2002/004750Application Date: 2002-02-12
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Publication No.: WO2002065517A2Publication Date: 2002-08-22
- Inventor: TODD, Michael, A.
- Applicant: ASM AMERICA, INC.
- Applicant Address: 3440 East University Drive, Phoenix, AZ 85034-7200 US
- Assignee: ASM AMERICA, INC.
- Current Assignee: ASM AMERICA, INC.
- Current Assignee Address: 3440 East University Drive, Phoenix, AZ 85034-7200 US
- Agency: ALTMAN, Daniel, E.
- Priority: US60/268,337 200102012; US60/279,256 200103027; US60/311,609 20010809; US60/323,649 200109019; US60/332,696 200111013; US60/333,724 200111028; US60/340,454 20011207
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
Trisilane is used in chemical vapor deposition methods to deposit silicon-containing films over mixed substrates. Such methods are useful in semiconductor manufacturing to provide a variety of advantages, including uniform deposition over heterogeneous surfaces, high deposition rates, and higher manufacturing productivity. An example is in forming the base region of a heterojunction bipolar transistor, including simultaneous deposition over both single crystal semiconductor surfaces and amorphous insulating regions.
Public/Granted literature
- WO2002065517A3 DEPOSITION METHOD OVER MIXED SUBSTRATES USING TRISILANE Public/Granted day:2002-08-22
Information query
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