Invention Application
- Patent Title: PIN GRID ARRAY SOCKET WITH REINFORCEMENT PLATE
- Patent Title (中): 带有加强板的PIN网格阵列插座
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Application No.: PCT/US0205459Application Date: 2002-02-22
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Publication No.: WO02069684A2Publication Date: 2002-09-06
- Inventor: HIRATA TOSHIHISA , SASAO MASAMI
- Applicant: MOLEX INC , HIRATA TOSHIHISA , SASAO MASAMI
- Assignee: MOLEX INC,HIRATA TOSHIHISA,SASAO MASAMI
- Current Assignee: MOLEX INC,HIRATA TOSHIHISA,SASAO MASAMI
- Priority: JP2001046576 2001-02-22
- Main IPC: H01R33/76
- IPC: H01R33/76 ; H01L23/32 ; H01R13/193 ; H05K7/10
Abstract:
A socket for a PGA package can maintain high reliability of connecting condition for a long period. The socket is constructed by mounting a reinforcement plate formed with a metal plate or the like at the position where the cam member contacts the slide plate so that the slide plate, which is formed of an insulative materials such as plastic or the like, will not be deformed upon exertion of a reaction force from a plurality of lead pins of a PGA package.
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