Invention Application
- Patent Title: PIN GRID ARRAY SOCKET WITH REINFORCEMENT PLATE
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Application No.: PCT/US2002/005459Application Date: 2002-02-22
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Publication No.: WO2002069684A3Publication Date: 2002-09-06
- Inventor: HIRATA, Toshihisa , SASAO, Masami
- Applicant: MOLEX INCORPORATED , HIRATA, Toshihisa , SASAO, Masami
- Applicant Address: 2222 Wellington Court, Lisle, IL 60532 US
- Assignee: MOLEX INCORPORATED,HIRATA, Toshihisa,SASAO, Masami
- Current Assignee: MOLEX INCORPORATED,HIRATA, Toshihisa,SASAO, Masami
- Current Assignee Address: 2222 Wellington Court, Lisle, IL 60532 US
- Agency: ZEITLER, Robert, J.
- Priority: JP46576/2001 20010222
- Main IPC: H05K7/10
- IPC: H05K7/10
Abstract:
A socket for a PGA package can maintain high reliability of connecting condition for a long period. The socket is constructed by mounting a reinforcement plate formed with a metal plate or the like at the position where the cam member contacts the slide plate so that the slide plate, which is formed of an insulative materials such as plastic or the like, will not be deformed upon exertion of a reaction force from a plurality of lead pins of a PGA package.
Information query
