Invention Application
- Patent Title: LASER ETCHING INDICIA APPARATUS
- Patent Title (中): 激光蚀刻印度设备
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Application No.: PCT/US2002/028772Application Date: 2002-09-10
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Publication No.: WO2003022505A1Publication Date: 2003-03-20
- Inventor: TRPKOVSKI, Paul
- Applicant: CARDINAL IG COMPANY , TRPKOVSKI, Paul
- Applicant Address: 775 Prairie Center Drive, Suite 200, Minnetonka MN 55344 US
- Assignee: CARDINAL IG COMPANY,TRPKOVSKI, Paul
- Current Assignee: CARDINAL IG COMPANY,TRPKOVSKI, Paul
- Current Assignee Address: 775 Prairie Center Drive, Suite 200, Minnetonka MN 55344 US
- Agency: GROENKE, Allen, W.
- Priority: US60/322,558 20010912; US10/084,113 20020225
- Main IPC: B23K26/00
- IPC: B23K26/00
Abstract:
An apparatus is provided for the automatic placement of indicia, such as logo, and manufacturer and material information, on planar workpieces, such as glass. This apparatus is suitable for line processing. When the workpiece arrives at the apparatus, a shuttle, housing a laser, moves over the workpiece to find the edges of the workpiece using an optical sensor also within the shuttle. The shuttle may then move to the interior of the workpiece according to a suitable offset as instructed by the soltware. When the shuttle is in position, the laser may impart one or more indicia to the workpiece at an orientation instructed by a software module. The indicia may consist, for example, of a graphic file, which my be made up of another graphics file such as a logo, and textual information regarding the workpiece properties, place or date of manufacture, or the like.
Information query