Invention Application
- Patent Title: TESTING CIRCUITS ON SUBSTRATES
- Patent Title (中): 测试基板上的电路
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Application No.: PCT/US2002/032357Application Date: 2002-10-09
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Publication No.: WO2003036306A2Publication Date: 2003-05-01
- Inventor: BOYLE, Timothy, J. , RICHTER, Wayne, E. , JOHNSON, Ladd, T. , TOM, Lawrence, A.
- Applicant: ELECTROGLAS, INC. , BOYLE, Timothy, J. , RICHTER, Wayne, E. , JOHNSON, Ladd, T. , TOM, Lawrence, A.
- Applicant Address: 6024 Silver Creek Valley Road, San Jose, CA 95138 US
- Assignee: ELECTROGLAS, INC.,BOYLE, Timothy, J.,RICHTER, Wayne, E.,JOHNSON, Ladd, T.,TOM, Lawrence, A.
- Current Assignee: ELECTROGLAS, INC.,BOYLE, Timothy, J.,RICHTER, Wayne, E.,JOHNSON, Ladd, T.,TOM, Lawrence, A.
- Current Assignee Address: 6024 Silver Creek Valley Road, San Jose, CA 95138 US
- Agency: SCHELLER, James, C., Jr.
- Priority: US10/035,482 20011022
- Main IPC: G01R
- IPC: G01R
Abstract:
The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.
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