A high-density connector utilizes a plurality of terminal assemblies that are assembled together into a block, or single unit, to form a connector. Each terminal assembly of the connector utilizes a plurality of conductive terminals having contact portions for mating with an opposing connector, and body portions held within an insulative body portion of the assembly. The terminal assemblies support arrays of terminals arranged in a specific order of signal-ground-signal arrays. The terminal assemblies have at least two insulative housing portions that support the signal terminal arrays and an intervening ground terminal array, which may or may not be supported by an associated insulative housing. The ground members have a series of grounding tabs formed therewith with extend out from the plane of the ground members, on opposite sides thereof into contact with ground reference terminals of the signal terminal arrays. In this manner, a ground path is enabled between the signal terminal and ground terminal arrays.