Methods for mounting electrical components (10, 20) on a substrate (40) and securely retaining the components (10, 20) are described. The methods include altering solder paste compositions (50), interposed between component retentive pins (25) and retentive through holes (46), during a reflow process. Electronic assemblies including circuit boards (40) and electrical components (10) mounted thereto are also described. In one of the electronic assembly embodiments (10, 20), materials originally associated with a mounted electrical component (10, 20) migrate in solder paste coupling the electrical components (10, 20) to the circuit board (40).