Invention Application
- Patent Title: FILAMENT BUNDLE REINFORCEMENT FABRIC
- Patent Title (中): FILAMENT BUILLE加强织物
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Application No.: PCT/US2004/000347Application Date: 2004-01-07
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Publication No.: WO2004063448A2Publication Date: 2004-07-29
- Inventor: HEAD, Andrew, A. , STORY, Thomas, C.
- Applicant: A & P TECHNOLOGY, INC. , HEAD, Andrew, A. , STORY, Thomas, C.
- Applicant Address: 4595 East Tech Drive, Cincinnati, OH 45245-1055 US
- Assignee: A & P TECHNOLOGY, INC.,HEAD, Andrew, A.,STORY, Thomas, C.
- Current Assignee: A & P TECHNOLOGY, INC.,HEAD, Andrew, A.,STORY, Thomas, C.
- Current Assignee Address: 4595 East Tech Drive, Cincinnati, OH 45245-1055 US
- Agency: SCHECHTER, Peter, C.
- Priority: US10/337,512 20030107
- Main IPC: D04H
- IPC: D04H
Abstract:
A filament bundle reinforcement fabric is produced in a tubular structure with a minimum optimized amount of adhesive which is consistently and uniformly applied at a pitch to the machine direction or to the direction of the filament bundles in their formed state.
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