Invention Application
- Patent Title: HIGH DENSITY ELECTRICAL CONNECTOR
- Patent Title (中): 高密度电气连接器
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Application No.: PCT/SG2004/000070Application Date: 2004-03-25
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Publication No.: WO2004086564A1Publication Date: 2004-10-07
- Inventor: SOH, Lip, Teck
- Applicant: FCI ASIA TECHNOLOGY PTE LTD , SOH, Lip, Teck
- Applicant Address: 10 Hoe Ching Road, #18-00 Keppel Towers, Singapore 089315 SG
- Assignee: FCI ASIA TECHNOLOGY PTE LTD,SOH, Lip, Teck
- Current Assignee: FCI ASIA TECHNOLOGY PTE LTD,SOH, Lip, Teck
- Current Assignee Address: 10 Hoe Ching Road, #18-00 Keppel Towers, Singapore 089315 SG
- Agency: DREW & NAPIER LLC
- Priority: SG200301490-9 20030325
- Main IPC: H01R4/48
- IPC: H01R4/48
Abstract:
A compression connector (1) for interconnecting a two electrical devices comprising, a housing (2) mounting at least one conductive element (3) defining; a first beam section (7) fastened to the housing (4) in a cantilevered manner allowing resilient deflection and having a first contact region (5) at the fastened end for connection to the first device, and a second beam section (8) extending at a first end thereof in a cantilevered manner from the movable end of the first beam section, the second beam section including a second contact (6) region away from the first end and disposed to engage with compressively, and deflectable by the first device. The conductive element is formed by out of plane bending to position the second beam back over the first beam, so that the wiping action by the first contact region of the second beam in a direction transverse to the compression engagement direction is controlled by geometry selection of the beams.
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