Invention Application
WO2004095544A2 SUBSTRATE WITH MULTIPLE CONDUCTIVE LAYERS AND METHODS FOR MAKING AND USING SAME
审中-公开
具有多个导电层的衬底及其制造和使用方法
- Patent Title: SUBSTRATE WITH MULTIPLE CONDUCTIVE LAYERS AND METHODS FOR MAKING AND USING SAME
- Patent Title (中): 具有多个导电层的衬底及其制造和使用方法
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Application No.: PCT/US2004/012297Application Date: 2004-04-21
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Publication No.: WO2004095544A2Publication Date: 2004-11-04
- Inventor: CALDWELL, David, W. , TAYLOR, Michael, Jon
- Applicant: TOUCHSENSOR TECHNOLOGIES, LLC
- Applicant Address: 203 N. Gables Boulevard, Wheaton, IL 60187 US
- Assignee: TOUCHSENSOR TECHNOLOGIES, LLC
- Current Assignee: TOUCHSENSOR TECHNOLOGIES, LLC
- Current Assignee Address: 203 N. Gables Boulevard, Wheaton, IL 60187 US
- Agency: VRLA, Mark, P.
- Priority: US60/464,438 20030422; US60/543,883 20040212; US10/828,997 20040420
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A layer of transparent conductive a material is disposed on a surface of a substrate. Further layers of conductive material are deposited on the layer of transparent conductive material or on an opposite surface of the substrate. The layers are selectively etched to yield a layout of pads for mounting electrical components and conductive traces forming an electrical circuit.
Information query
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