Invention Application
WO2004099459A8 Enhanced metal ion release rate for anti-microbialapplications
审中-公开
增强抗微生物应用的金属离子释放速率
- Patent Title: Enhanced metal ion release rate for anti-microbialapplications
- Patent Title (中): 增强抗微生物应用的金属离子释放速率
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Application No.: PCT/US2004013355Application Date: 2004-04-30
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Publication No.: WO2004099459A8Publication Date: 2006-05-26
- Inventor: CHANDRA N SATISH , NAIK VINESH
- Applicant: NOBLE FIBER TECHNOLOGIES INC NOBLE FIBER TECHNOLOGIES,INC , CHANDRA N SATISH , NAIK VINESH
- Assignee: NOBLE FIBER TECHNOLOGIES INC NOBLE FIBER TECHNOLOGIES,INC,CHANDRA N SATISH,NAIK VINESH
- Current Assignee: NOBLE FIBER TECHNOLOGIES INC NOBLE FIBER TECHNOLOGIES,INC,CHANDRA N SATISH,NAIK VINESH
- Priority: US46767803 2003-05-02
- Main IPC: B05D5/00
- IPC: B05D5/00 ; B32B3/00 ; C23C20060101 ; C23C18/16 ; C23C18/20 ; C23C18/44 ; D02G3/00 ; D02G3/44
Abstract:
A method for enhancing the metal ion release rate of a substrate having a coating of a metal thereon. The method includes the steps of forming the metalcoated substrate and then subjecting the metal-coated substrate to a step that removes portions of the metal coating to form at least one notch in the metal coating, thereby increasing the surface area of the metal coating. The increased surface area enhances the metal ion release rate of the substrate. The metal may be silver. A silver-coated substrate may be used in the formation of medical products having increased antimicrobial and/or anti-fungal characteristics.
Public/Granted literature
- WO2004099459A3 ENHANCED METAL ION RELEASE RATE FOR ANTI-MICROBIAL APPLICATIONS Public/Granted day:2005-03-10
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