Devices (10) are formed of a conductive loaded resin-based material (12) with a plated metal layer (14) overlying. The conductive loaded resin-based material (12) comprises micron conductive powder(s)(34), conductive fiber(s) (38), or a combination thereof, in a a base resin host. The ratio of the weight of the conductive powder(s) (34), conductive fiber(s)(38), or a combination thereof, to the weight of the base resin host is between 0.20 and 0.40. The micron conductive powders (34) are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers (38) preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.