Invention Application
- Patent Title: A PACKAGE FOR MICROCHIPS
- Patent Title (中): MICROCHIPS的包装
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Application No.: PCT/US2003/041515Application Date: 2003-12-30
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Publication No.: WO2005041250A2Publication Date: 2005-05-06
- Inventor: GILLEO, Kenneth, B.
- Applicant: COOKSON ELECTRONICS, INC. , GILLEO, Kenneth, B.
- Applicant Address: 225 Foxborough Blvd., Suite 150, Foxborough, MA 02035 US
- Assignee: COOKSON ELECTRONICS, INC.,GILLEO, Kenneth, B.
- Current Assignee: COOKSON ELECTRONICS, INC.,GILLEO, Kenneth, B.
- Current Assignee Address: 225 Foxborough Blvd., Suite 150, Foxborough, MA 02035 US
- Agency: CLAERBOUT, Andrew, N.
- Priority: US10/669,901 20030924
- Main IPC: H01L
- IPC: H01L
Abstract:
A package for protecting an integrated circuit device having an active side. The package includes a substrate for mounting the integrated circuit device and a plastic cap mounted on the substrate to form an enclosed space for the active side of the integrated circuit device. A thermal bond is formed between the substrate and the plastic cap to effectively seal the enclosed space so as to prevent the ingress of moisture or particulate.
Information query
