Invention Application
- Patent Title: MODULE CARD EJECTING MECHANISM
- Patent Title (中): 模块卡出口机制
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Application No.: PCT/SG2004/000428Application Date: 2004-12-29
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Publication No.: WO2005064752A1Publication Date: 2005-07-14
- Inventor: JUANG, Aruong
- Applicant: FCI ASIA TECHNOLOGY PTE LTD , FCI , JUANG, Aruong
- Applicant Address: 10 Hoe Chiang Road, #18-00 Keppel Towers, Singapore 089315 SG
- Assignee: FCI ASIA TECHNOLOGY PTE LTD,FCI,JUANG, Aruong
- Current Assignee: FCI ASIA TECHNOLOGY PTE LTD,FCI,JUANG, Aruong
- Current Assignee Address: 10 Hoe Chiang Road, #18-00 Keppel Towers, Singapore 089315 SG
- Agency: ELLA CHEONG SPRUSON & FERGUSON (SINGAPORE) PTE LTD
- Priority: TW092137486 20031230
- Main IPC: H01R13/635
- IPC: H01R13/635
Abstract:
The present invention discloses a module card ejecting mechanism comprising an ejecting plate and a push-push ejecting mechanism, wherein the push-push ejecting mechanism substantially comprises a housing, a pushing rod, a rotator, a spring and an end cap.
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