Invention Application
- Patent Title: LIGHT BEAM BONDING
- Patent Title (中): 光束粘合
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Application No.: PCT/JP2005006285Application Date: 2005-03-31
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Publication No.: WO2005096458B1Publication Date: 2005-12-08
- Inventor: OKANO KAZUYA
- Applicant: FCI ASIA TECHNOLOGY PTE LTD , FRAMATOME CONNECTORS INT , OKANO KAZUYA
- Assignee: FCI ASIA TECHNOLOGY PTE LTD,FRAMATOME CONNECTORS INT,OKANO KAZUYA
- Current Assignee: FCI ASIA TECHNOLOGY PTE LTD,FRAMATOME CONNECTORS INT,OKANO KAZUYA
- Priority: JP2004107905 2004-03-31
- Main IPC: H01R43/02
- IPC: H01R43/02 ; H05K3/34
Abstract:
A soldering method using light beams and a mask for light beam shielding. The soldering method is a method for connecting a conductive line with a contact by light beams, which includes a step of arranging the conductive line in an area whereupon the contact is formed, a step of supplying a solder to the area whereupon the contact is formed, a step of arranging the mask for partially shielding the connector from light beams, and a step of connecting the conductive line with the contact by melting the solder by irradiating light beams.
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