Invention Application
- Patent Title: LED BONDING STRUCTURES AND METHODS OF FABRICATING LED BONDING STRUCTURES
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Application No.: PCT/US2005/014493Application Date: 2005-04-27
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Publication No.: WO2005106497A3Publication Date: 2005-11-10
- Inventor: SLATER, David, Beardsley, Jr. , EDMOND, John, Adam
- Applicant: CREE, INC. , SLATER, David, Beardsley, Jr. , EDMOND, John, Adam
- Applicant Address: 4600 Silicon Drive, Durham, NC 27703-8475 US
- Assignee: CREE, INC.,SLATER, David, Beardsley, Jr.,EDMOND, John, Adam
- Current Assignee: CREE, INC.,SLATER, David, Beardsley, Jr.,EDMOND, John, Adam
- Current Assignee Address: 4600 Silicon Drive, Durham, NC 27703-8475 US
- Agency: SUMMA, Philip et al.
- Priority: US60/565,960 20040428
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
An LED chip includes a bond pad suitable for thermosonic or thermocompression bonding such as Sn, AuSn or other metals. The physical dimensions of the bond pad are selected to discourage or prevent solder squeeze-out during thermocompression or thermosonic bonding with or without flux. In some embodiments, an AuSn bond pas is designed to accept 30g to 70g of force or more without squeeze-out.
Information query
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